RF, mm-wave and THz circuits 
Wireline and Optical Circuits As the demand for faster and more accessible wireless communication continues to grow, traditional PCB technologies using materials like FR4 or Rogers RO4000 are reaching their performance limits for mm-wave applications. The push towards 6G requires innovative solutions capable of operating at higher frequencies (e.g. D-band: 110 - 170 GHz) to provide greater data throughput. Glass PCBs and interposers present a promising path forward, offering superior dielectric properties and lower losses in the packaging of mm-wave integrated circuits.
This research aims to develop glass mm-wave integrated circuit (IC) interposers using a femtosecond laser to process quartz substrates. Initially, structures such as vias and cavities will be created by ablating the quartz with the laser. These substrates will then be coated with a gold layer, which in turn can be selectively ablated to form the necessary PCB traces. In a further stage, components like filters, antennas, and power combiners can also be integrated onto the glass interposers. This would then allow for the heterogeneous integration of multiple mm-wave ICs to enable the design of more advanced systems.
