Actually Mimicking of Neuron Action Potential by A Single RRAM DeviceB Wang, Z Wang, Y Fang, Q Chen, L Bao, Y Yang, Y Cai, and R Huang · Conference Proceeding · 20182018 14th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT); 2018; pp. 43 - 45
Optimized Hierarchical Cascaded ProcessingKoen Goetschalckx, Bert Moons, Steven Lauwereins, Martin Andraud, and Marian Verhelst · Journal Article · 2018IEEE Journal On Emerging And Selected Topics In Circuits And Systems; 2018; Vol. 8; iss. 4; pp. 884 - 894
Operational experience with the GEM detector assembly lines for the CMS forward muon upgradeMietek Dabrowski, D Abbaneo, M Abbrescia, A Ahmad, W Ahmed, C Ali, PR Altieri, M Amr, I Asghar, P Aspell, Y Assran, C Avila, Y Ban, R Band, S Bansal, G Bencze, N Beni, L Benussi, V Bhatnagar, V Bhopatkar, M Bianco, S Bianco, L Borgonovi, O Bouhali, S Braibant-Giacomelli, C Bravo, V Cafaro, C Calabria, M Caponero, F Cassese, A Castaneda Hernandez, FR Cavallo, N Cavallo, G Chen, SS Chhibra, S Choi, S Colafranceschi, A Colaleo, A Conde Garcia, MM Dabrowski, M Dalchenko, G De Lentdecker, G De Robertis, S Dildick, J Dong, B Dorney, G Endroczi, R Erbacher, F Errico, F Fallavollita, P Giacomelli, SG Gigli, J Gilmore, V Giordano, M Gola, CF Gonzalez Hernandez, M Gruchala, L Guiducci, R Gupta, A Gutierrez, R Hadjiiska, T Hakkarainen, Md Hasbuddin, J Hauser, C Heidemann, K Hoepfner, M Hohlmann, H Hoorani, H Huang, T Huang, P Iaydjiev, V Jha, A Juodagalvis, E Juska, T Kamon, PE Karchin, A Kaur, H Keller, WA Khan, JS Kim, H Kim, A Kotsokechagia, A Kumar, P Kumari, JSH Lee, T Lenzi, A Leonard, P Leroux, Q Li, L Litov, F Loddo, M Lohan, T Maerschalk, M Maggi, A Magnani, N Majumdar, A Makovec, S Malhotra, A Marinov, N Mccoll, C Mclean, JA Merlin, DK Mishra, S Mohamed, T Mohamed, J Molnar, S Muhammad, S Mukhopadhyay, Md Naimuddin, PK Netrakant, S Nuzzo, LM Pant, P Paolucci, I Park, L Passamonti, G Passeggio, B Pavlov, A Peck, H Petrow, B Philipps, D Piccolo, D Pierluigi, F Primavera, A Purohit, R Radogna, G Raffone, M Rahmani, A Ranieri, V Rapsevicius, G Rashevski, M Ressegotti, C Riccardi, M Rodozov, E Romano, JD Ruiz Alvarez, A Russo, R King, A Safonov, D Saltzberg, S Salva, G Saviano, A Shah, A Sharma, R Sharma, M Shopova, F Simone, JB Singh, E Soldani, J Sturdy, A Sultan, G Sultanov, Z Szillasi, F Tavernier, F Thyssen, T Tuuva, M Tytgat, B Ujvari, I Vai, R Venditti, P Verwilligen, P Vitulo, D Wang, Y Yang, U Yang, X Yang, R Yonamine, S Zaleski, F Zenoni, and ER Starling · Journal Article · 2018IEEE Transactions On Nuclear Science; 2018; Vol. 65; iss. 11; pp. 2808 - 2816
Towards resource-efficient classifiers for always-on monitoringJonas Vlasselaer, Wannes Meert, and Marian Verhelst · Conference Proceeding · 2018Proceedings of the European Conference on Machine Learning and Principles and Practice of Knowledge Discovery in Databases (ECML/PKDD); 2018; Vol. 11053 LNAI; pp. 305 - 321
THz Circuits in CMOS: Dream or Nightmare?Kaizhe Guo, Wouter Steyaert, Alexander Standaert, Dragan Simic, and Patrick Reynaert · Journal Article · 20182018 First International Workshop on Mobile Terahertz Systems (IWMTS); 2018
STEM Education in Flanders: How STEM@school aims to foster STEM literacy and a positive attitude towards STEMHeidi Knipprath, Lieve Thibaut, Marie-Paule Buyse, Stijn Ceuppens, Haydee De Loof, Jolien De Meester, Leen Goovaerts, Annemie Struyf, Jelle Boeve-De Pauw, Fien Depaepe, Johan Deprez, Mieke De Cock, Luc Hellinckx, Greet Langie, Katrien Struyven, Didier Van de Velde, Peter Van Petegem, and Wim Dehaene · Journal Article · 2018IEEE Instrumentation & Measurement Magazine; 2018; Vol. 21; iss. 3; pp. 36 - 40
Printed Organic Photodetector Arrays and their use in Palmprint ScannersHylke Akkerman, Bart Peeters, Albert Van Breemen, Santhosh Shanmugam, Daniel Tordera, Jan-Laurens van der Steen, Auke Jisk Kronemeijer, Pawel E Malinowski, Florian De Roose, David Cheyns, Jan Genoe, Wim Dehaene, Paul Heremans, and Gerwin Gelinck · Conference Proceeding · 2018Society for Information Display International Symposium Digest of Technical Papers; 2018; pp. 494 - 497