Control of Fully Intergrated DC-DC converters in CMOSTom Van Breussegem, Mike Wens, and Michiel Steyaert · Conference Proceeding · 2011Analog Circuit Design - Low Voltage Low Power; Short Range Wireless Front-Ends; Power Management and DC-DC, AACD 2011; 2011; pp. 357 - 374
ADCs and DACs for Software-Defined RadioMichiel Steyaert, Pieter Palmers, and Koen Cornelissens · Book Chapter · 2011Multi-Mode/Multi-Band RF Transceivers for Wireless Communications ; 2011; pp. 159 - 186
Physical Bound on Q Factor for Planar AntennasKarim Mohammadpour-Aghdam, Reza Faraji-Dana, Guy AE Vandenbosch, Soheil Radiom, and Georges GE Gielen · Conference Proceeding · 20112011 41ST EUROPEAN MICROWAVE CONFERENCE; 2011; pp. 250 - 252
Design Considerations for 60 GHz CMOS Power AmplifiersYing He, Dixian Zhao, Lianming Li, and Patrick Reynaert · Conference Proceeding · 2010Proceedings of Asia-Pacific Microwave Conference 2010; 2010; pp. 1613 - 1616
Application of Organic Thin-Film Transistors for Circuits on Flexible FoilsPaul Heremans, Kris Myny, Hagen Marien, Erik van Veenendaal, Soeren Steudel, Michel Steyaert, and Gerwin Gelinck · Conference Proceeding · 2010IDW'10: PROCEEDINGS OF THE 17TH INTERNATIONAL DISPLAY WORKSHOPS, VOLS 1-3; 2010; Vol. 2; pp. 1677 - 1680
A 60GHz 15.7mW Static Frequency Divider in 90nm CMOSLianming Li, Patrick Reynaert, and Michel Steyaert · Conference Proceeding · 2010ESSCIRC 2010 - 36th European Solid State Circuits Conference; 2010; pp. 246 - 249
An organic integrated capacitive DC-DC up-converterHagen Marien, Michel Steyaert, Soeren Steudel, Peter Vicca, Steve Smout, Gerwin Gelinck, and Paul Heremans · Conference Proceeding · 2010Conference Proceedings, 36th European Solid-State Circuits Conference ; 2010; pp. 510 - 513
Sizing mixed-mode circuits by multi-objective evolutionary algorithmsI Guerra-Gomez, E Tlelo-Cuautle, T McConaghy, LG de la Fraga, Georges Gielen, G Reyes-Salgado, and JM Munoz-Pacheco · Conference Proceeding · 201053RD IEEE INTERNATIONAL MIDWEST SYMPOSIUM ON CIRCUITS AND SYSTEMS; 2010; pp. 813 - 816
Roughness analysis for EUV lithographyA Vaglio Pret, Pavel Poliakov, D Bianche, R Gronheid, P Blomme, Miranda Corbalan, J Van Houdt, and Wim Dehaene · Conference Proceeding · 2010
Efficient simulation model for DAC dynamic propertiesPieter De Wit and Georges Gielen · Conference Proceeding · 2010Proceedings of 2010 IEEE International Symposium on Circuits and Systems (ISCAS) ; 2010; pp. 2896 - 2899
Compact Model for Organic Thin-Film TransistorLing Li, Hagen Marien, Jan Genoe, Michel Steyaert, and Paul Heremans · Journal Article · 2010IEEE Electron Device Letters ; 2010; Vol. 31; iss. 3; pp. 210 - 212
Circuit Design for Bias Compatibility in Novel FinFET based floating RAMPavel Poliakov, A Anchlia, M Garia Bardon, Bram Rooseleer, B De Wachter, N Collaert, K van der Zanden, Wim Dehaene, D Verkest, and Miranda Corbalan · Journal Article · 2010IEEE Transactions on Circuits and Systems II, Express Briefs ; 2010; Vol. 57; iss. 3; pp. 183 - 187
All-digital differential VCO-based A/D conversionJorg Daniels, Wim Dehaene, and Michel Steyaert · Conference Proceeding · 2010Proceedings of 2010 IEEE International Symposium on Circuits and Sytems (ISCAS) ; 2010; pp. 1085 - 1088
An RDL-configurable 3D memory tier to replace on-chip SRAMMarco Facchini, Pol Marchal, Francky Catthoor, and Wim Dehaene · Conference Proceeding · 2010Proceedings of the Design, Automation and Test in Europe Conference - DATE ; 2010; pp. 291 - 294
Test structures for characterization of through silicon viasMichele Stucchi, Dan Perry, Guruprasad Katti, and Wim Dehaene · Conference Proceeding · 2010Proceedings of the 23rd IEEE International Conference on Microelectronic Test Structures - ICMTS ; 2010; pp. 130 - 134
Verifying electrical/thermal/thermo-mechanical behavior of a 3D stack-challenges and solutionsGeert Van der Plas, Steven Thijs, Dimitri Linten, Katti Guruprasad, Paresh Limaye, Abdelkarim Mercha, Michele Stucchi, Herman Oprins, Bart Vandevelde, Nikolas Minas, Miro Cupac, Morin Dehan, Marc Nelis, Rahul Agarwal, Wim Dehaene, Youssef Travaly, Eric Beyne, and Paul Marchal · Conference Proceeding · 2010IEEE Custom Integrated Circuits Conference; 2010; pp.
Temperature dependent electrical characteristics of through-si-via (TSV) interconnectionsGuruprasad Katti, Abdelkarim Mercha, Michele Stucchi, Zsolt Tokei, Dimitrios Velenis, Jan Van Olmen, Cedric Huyghebaert, Anne Jourdain, Michal Rakowski, Ingrid Debusschere, Philippe Soussan, Herman Oprins, Wim Dehaene, Kristin De Meyer, Youssef Travaly, Eric Beyne, Serge Biesemans, and Bart Swinnen · Conference Proceeding · 2010Proceedings of the IEEE International Interconnect Technology Conference - IITC; 2010