In recent years, ultrasound systems have advanced significantly, finding uses in medical imaging, obstacle detection, and emerging fields like volumetric displays and ultrasonic powering. However, challenges arise as these systems evolve towards larger and more complex setups, facing limitations in scalability, routing congestion, power consumption and cost. This work proposes a hybrid solution, integrating thin-film circuits with silicon technology to address these challenges. This innovative approach aims to unlock scalability while ensuring cost-effectiveness by combining large-area thin-film transducers with pitch-matched thin-film transistor driving circuits.
6/6/2024 16:00 - 18:00
ESAT Aula L
