The MICAS Technology Lab provides services for state of the art circuit modification and chip repair.
A specialized Focused Ion Beam System (FIB) is available for advanced editing operations. Several materials can be removed and deposited with nanometer accuracy so that circuits can be modified without the need for re-processing. A unique feature of the system is the increased working distance so that electrical components around the chip won't hinder the repair operation. Therefore the FIB is able to make modifications not only on single dies or on chip packages but even on dies directly mounted onto a PCB.
In addition to the FIB there is a CNC controlled grinding machine that is able to perform decapsulation, silicon thinning, polishing and cleaning of integrated circuits. This machine is often used for sample preparation prior to backside editing with the FIB system. Typically the bulk silicon at the back of the die is removed until a remaining thickness of around 50um to 100um is left.
In this seminar, the possibilities and limitations of both machines will be discussed.
The real life measuring of your design ideas is an important part of your PhD education. The privilege to use the unique and excellent IC-Lab measurement Lab is not unconditional.
Prerequisite knowledge of the Lab rules and connector care is essential for unrestricted lab use. In the second part of the seminar the Lab rules and the importance of connector care will be highlighted.
15/3/2024 11:00 - 12:00
ESAT B91.200
